Re-released: TRAK Microwave, a Smiths Interconnect brand, is pleased to announce the completion of an enhancement to our Surface Mount Technology (SMT) circuit card assembly (CCA) line. As part of our continual process improvement efforts at Smiths Interconnect, we are updating and improving our capabilities while ensuring all existing products and programs continue to meet or exceed current requirements across a variety of commercial and military markets.
With this SMT equipment improvement in place, a new screen printer DEK Horizon 8 has been installed in-line with our current SMT screen printer DE K Horizon 3. The existing DEK Horizon 3 has been dedicated to provide products fully compliant with new European Parliament Directive 2011/65/EU Restrictions on Hazardous Substances (RoHS). That is to say the DEK Horizon 3 is being utilized to run lead-free solders while the new DEK 8 is used for all current programs requiring tin-lead solders.
For customers requiring tin-lead solder, our new DEK Horizon 8 screen printer enhances our capabilities by providing an improved camera, improved solder paste inspection capability, and additional machine parameters for process monitoring. Smiths Interconnect will make no process, design, or material changes related to this new screen printer for any tin-lead soldered products. The DEK Horizon 8 is backwards compatible and any new features would be optional and secondary to the unchanged main process. All current inspection techniques will remain unchanged as does the oven and all related soldering profiles.
For customers requiring lead-free (RoHS compliant) solder, the DEK Horizon 3 provides dedicated service for products requiring lead-free solders. Since these products will undergo both printed circuit board (PCB) drawing updates as well as Bill of Material (BOM) updates to achieve the new RoHS compliancy, a full battery of testing and inspection is being performed and documented to validate these updates. Smiths Interconnect will ensure that no product shipping under this new configuration will leave our facility without fully verifying and documenting compliancy. All current inspection standards will remain unchanged and any changes to oven soldering profiles will undergo internal Qualification and First Article Inspection.
To learn more about Smiths Interconnect's complete market capabilities visit: http://www.smithsinterconnect.com/markets